WHAT WE DESIGN
A full PCB design practice, not a single skill.
The same team that builds AID-IOT's own edge devices designs boards for yours — across digital, RF, power and mixed-signal domains, from a two-layer sensor node to a dense multi-layer gateway.
Schematic design & capture
Hierarchical schematics, considered part selection and simulation of critical nets — reviewed before a single track is routed.
Multi-layer PCB layout
From 2 to 16+ layers with disciplined stack-ups, controlled impedance and dense BGA fan-out for compact, reliable boards.
High-speed digital
DDR3/4, USB, Ethernet and MIPI routed with length-matching, reference-plane control and tight impedance budgets.
RF & antenna
2.4 GHz, sub-GHz and NavIC / GNSS front-ends with matching networks, ground stitching and disciplined keep-outs.
Power & mixed-signal
DC-DC conversion, high-current planes and thermal relief laid out for low noise and EMC compliance from the start.
Signal & power integrity
SI/PI analysis, decoupling strategy and clean return paths so the board behaves the way the schematic promised.
DFM · DFA · DFT
Manufacturability, assembly and test designed in against your fab and line — fewer spins, higher yield.
Flex & rigid-flex
Bend-aware stack-ups and dynamic-flex routing for wearables, rugged enclosures and tight mechanical envelopes.
Fab & assembly handoff
Gerber / ODB++, BOM, pick-and-place, drill and fab notes — a complete, unambiguous package ready to build.
HOW WE WORK
A disciplined path from idea to a board that ships.
Six stages, one accountable team. Every gate has a review, so problems are caught on screen — not on the bench after a costly spin.
TECHNOLOGY
Stack-ups and tolerances built for real fabrication.
We design to the capabilities of proven fabricators — so the data we release builds first time, at the yield and cost you planned for.
Layer count
2 – 16+ layers
Min track / space
3 / 3 mil (0.075 mm)
Min mechanical via
0.15 mm finished
Impedance control
±10%, single & differential
Base materials
FR-4, high-Tg, Rogers, flex
Surface finish
ENIG · HASL · OSP
Board types
Rigid · flex · rigid-flex
Smallest package
0201 passives · 0.4 mm BGA
STANDARDS & TOOLING
Designed to standard. Documented for the line.
Every board is designed and verified to recognised IPC standards and handed off with documentation a fabricator and assembler can build from without a single clarifying email.
IPC-2221
Generic PCB design
IPC-2152
Current-carrying capacity
IPC-6012
Rigid board qualification
IPC-A-610
Assembly acceptability
IPC-7351
Land-pattern standards
RoHS / REACH
Material compliance
HANDOFF PACKAGE
Gerber X2 / ODB++Drill & fab notesBill of materialsPick-and-placeAssembly drawingsImpedance report3D STEP modelSELECTED WORK
Boards we've taken from schematic to silicon.
A cross-section of recent designs across IoT, RF, power and wearable form factors.
PART OF A WHOLE SYSTEM
PCB design that already knows the rest of your product.
We don't design boards in isolation. AID-IOT builds complete IoT systems — so your PCB arrives aligned with firmware, enclosure and the realities of production.
Firmware-aware layout
The team writing the firmware sits beside the one routing the board — pin-maps and bring-up are settled together, not over a fence.
Enclosure & mechanical fit
Boards designed to the 3D model from day one: connector placement, mounting, height and thermal all reconciled before fabrication.
Production & supply aware
Component choices weighed for availability, lifecycle and cost, so the design that passes review is the design you can actually build at volume.
Have a problem?
We design, deploy, and scale the
solution.
